Reflow Profile and Assembly Instructions

Last modified November 9, 2015

Baking

GHI SoMs are moisture sensitive. It is recommended that the device be baked before reflow. The recommended baking time and temperature is 24 hours at 124 degrees Celsius.

Recommended Reflow Profile

NOTE: The profiles shown are based on SAC 305 solder (3% silver, 0.5% copper).  The thermal mass of the assembled board and the sensitivity of the comonents on it affect the total dwell time. Differences in the two profiles are where they reach their respective peak temperatures, as well as the time abover liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to lareger assemblies, such as backplanes or high-density boards. The process window is described by the shaded area. These profiles are starting-points (mainly guidance), the particulars of your oven and your assembly will determine your final process. 

  

  

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